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Thermal conductive adhesive
Thermal conductive adhesive

1. Excellent thermal conductivity, with a thermal conductivity coefficient [W/(m · k)] of 0.9 after curing; 2. Better adhesive strength, especially with good adhesion to plastics such as electronic components, aluminum, PC, PVC, PBT, etc; 3. Fast curing

Introduction

1. Appearance: white semi collapsed shape. 2. Excellent adhesion to power substrate aluminum, copper, wire, and plastic 3. Waterproof and moisture-proof, excellent electrical insulation performance, protecting components from mechanical vibration and external impact 4. Flame retardant performance reaches UL94 V-0 level 5. Through international environmental protection Rohs and EU Reach certification

Features

high reliability

high reliability

High thermal conductivity

High thermal conductivity

high compressibility, soft and elastic

high compressibility, soft and elastic

Natural viscosity, double-sided self-adhesive

Natural viscosity, double-sided self-adhesive

Compliant with ROHS and UL environmental requirements

Compliant with ROHS and UL environmental requirements

Application Way

Sealing for insulation and fixation of electronic components Panel light bonding, projection panel bonding with bottom shell Adhesive and sealing of metal and plastic shells for other chargers Adhesive sealing and mechanical bonding sealing in the fiel

Application Areas

Product Data

Project

Performance indicators

reference standard

Test results




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Appearance 

Visual inspection

 (white) paste

Relative density (g/cm3)

GB/T 13354-1992

1.5±0.1

Surface drying time (min) 

Winter (  November  April )

 

GB/T13477.5-2002

 

10~30

Surface drying time (min) 

Summer (  May  October )

 

GB/T13477.5-2002

 

10~20

 

Full curing time (h)

Humidity 55-75%

Temperature 27±2℃

 

twenty four

Curing type

Adhesive Analysis and Testing Technology

Methanol type

Extrudability (g/10s) air pressure 50psi

GB/T 13477.4-2002

65-85

 

 

 

 

 

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Hardness (Shore A) 

GB/T 531.1-2008

45±5

Tensile strength (MPa)

GB/T528-2009

≥1.5

Shear strength (MPa)

GB/T7124-2008

≥1.0

Elongation at break (%)

GB/T 528-2009

>150

Peel strength (N/mm)

GB/T7124-2008

>25

Operating temperature range (℃)

Adhesive Analysis and Testing Technology

-50~200

Volume resistivity (Ω·cm) 

GB/T 1692-2008

>2.0×10 14

Dielectric strength (kV/·mm)

GB/T 1695-2005

≥18

Dielectric constant (1.2MHz)

GB/T1693-2007

≤4.0

Test conditions: room temperature 25°C, relative humidity 55%, 7 days after complete curing.


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