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Thermal conductive sealing adhesive
Thermal conductive sealing adhesive

1. Under normal temperature, the A/B glue can be operated for a long time after mixing (operation time: a period of time before the gel is thickened); Under heating conditions, it can cure quickly, which is beneficial for use on automatic production lines

Introduction

Thermal conductive sealing adhesive is a two-component silicone adhesive used as the base material, with a certain proportion of heat-resistant and flame-retardant additives added, and cured to form a thermal conductive sealing adhesive. It can reliably protect sensitive circuits and components in a wide range of temperature and humidity changes for a long time, and also has certain characteristics such as earthquake resistance, fall resistance, and dust prevention

Features

high reliability

high reliability

High thermal conductivity

High thermal conductivity

high compressibility, soft and elastic

high compressibility, soft and elastic

Natural viscosity, double-sided self-adhesive

Natural viscosity, double-sided self-adhesive

Compliant with ROHS and UL environmental requirements

Compliant with ROHS and UL environmental requirements

Application Way

Used for potting protection of high-power electronic components in module power supplies and circuit boards. Such as automotive HID lamp module power supply, automotive ignition system module power supply, solar panels, transformers, sensors, etc.

Application Areas

Product Data

Performance indicatorsreference standardTest value
Before curingAppearanceVisual inspectionWhite (A)/Gray (B) fluid
Viscosity of component A (mPa.s, 25℃)GB/T 2794-19956000~7500
Viscosity of component B (mPa.s, 25℃)GB/T 2794-199512000~14000
AB mixing density (g/ml)GB/T 13554-922.2±0.1g/ml
Operation performanceTwo-component mixing ratio (weight ratio)Actual test using systemA:B=1:1
Viscosity after mixing (mPa.s, 25℃)GB/T 2794-19959000~12000
Operating time (min, 25℃)Actual test of usage environment20
Tack drying time (min, 25℃)GB/T 13477.5-200250~90
Initial solidification time (min, 25℃)Actual test of usage environment180
After curingHardness(shore A)GB/T 531.1-200840±5
Thermal conductivity [W (m·K)]ASTM D5470-06 1.5±0.15
Dielectric strength (kV/mm)GB/T 1695-2005≥18
Dielectric constant (1.2MHz)GB/T 1693-2007≤4.0
Volume resistivity (Ω·cm)GB/T 1692-2008≥1×10 14
Operating temperature range (℃)Actual test of usage environment-40~200
Elongation at break (%)GB/T 528-200920
Tensile strength (MPa)GB/T 528-20091.1


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