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TP500 CPU Thermal Conductive Silicone Pad -5W Heat Dissipation Silicone Gasket
TP500 CPU Thermal Conductive Silicone Pad -5W Heat Dissipation Silicone Gasket

thermal conductivity: 5.0 W/m.K; Highly compatible; Natural viscosity, easy to use; Good temperature resistance performance

Introduction

TP500 is a material with high thermal conductivity, double-sided self-adhesive. When assembled with electronic components, it exhibits low thermal resistance and good electrical insulation properties under low compression force. It can work stably at -40 ℃~200 ℃ and meet the flame retardant rating requirements of UL94V0

Features

high reliability

high reliability

High thermal conductivity

High thermal conductivity

high compressibility, soft and elastic

high compressibility, soft and elastic

Natural viscosity, double-sided self-adhesive

Natural viscosity, double-sided self-adhesive

Compliant with ROHS and UL environmental requirements

Compliant with ROHS and UL environmental requirements

Application Way

Network and telecommunications; It: Laptops, tablets, power converters; Industry: led, Power supply and conversion; Automobile: control module, turbine actuator; Consumer electronics products: gaming systems and LCD displays

Application Areas

communication device

communication device

computer

computer

Product Data

propertyTypical ValueTest Standards
brandHigh-tech-
modelTP500-
ComponentsSilicone + ceramic-
colorGray/customizedVisual
Thickness (mm)1.0~6.0mmASTM D374
Density (g/cc)3.2ASTM D792
Hardness (Shore C)50ASTM D2240
Elongation%--
Long-term use temperature (℃)-40~200-
Fire performanceV-0UL94
Electrical properties
Breakdown voltage (kV/mm)≥6.0
ASTM D149
Dielectric constant (@1MHz)7.4ASTM D150
Volume resistivity (Ω.cm)1010ASTM D257
Thermal conductivity
Thermal conductivity (W/mK)5.0WASTMD5470


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