Thermal conductivity: 3.0W/m.K, no silicone oil precipitation or silicone evaporation, good mechanical properties, strong self-adhesive type, can be peeled off on one side, high insulation, high compression, stable size, and good durability.
The SF series silicon free thermal conductive gasket is a high thermal conductivity, high strength, and flame-retardant interface thermal conductive material designed and developed specifically for applications sensitive to organic silicon. Multiple models have been developed for different application scenarios, which can meet various application requirements such as high compression, multiple rework, tear resistance, and high-frequency vibration impact
high reliability
High thermal conductivity
high compressibility, soft and elastic
Natural viscosity, double-sided self-adhesive
Compliant with ROHS and UL environmental requirements
communication device
computer
| Brand | High-tech | - |
| model | TP300-SF | - |
| Components | Acrylate | - |
| color | Blue/Gray | Visual |
| Thickness (mm) | 1.0-10.0 | ASTM D374 |
| Density (g/cc) | 3 | ASTM D792 |
| Hardness (shore oo) | 50 | ASTM D2240 |
| Elongation% | - | - |
| Long-term use temperature (℃) | -40-150 | - |
| Fire performance | V-1 | UL94 |
| Electrical properties | ||
|---|---|---|
| Breakdown voltage (kv/mm) | ≥6.0 | ASTM D149 |
| Dielectric constant (@1mhz) | 10.14 | ASTM D150 |
| Volume resistivity (Ω.cm) | 5*1011 | ASTM D257 |
| Thermal conductivity | ||
| Thermal conductivity (W/mK) | 3 | ASTMD5470 |
| Thermal resistance (°C*in 2 /W.1mm,50psi) | 0.344 | ASTM D5470 |
