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Weak viscosity high thermal conductivity thermal silicon film TP1000
Weak viscosity high thermal conductivity thermal silicon film TP1000

thermal conductivity: 10.0W/m.K High thermal conductivity Low-permeability oil High electrical insulation Resilient and easy to operate High compression ratio, low compression force

Introduction

TP1000 is a material with high thermal conductivity of 10.0W/m.K, with weak surface adhesion, suitable for thermal conduction and heat dissipation systems of high-power heating components. It can be used to fill small gaps and uneven surfaces, meeting the flame retardant rating requirements of UL 94 V-0

Features

high reliability

high reliability

High thermal conductivity

High thermal conductivity

high compressibility, soft and elastic

high compressibility, soft and elastic

Natural viscosity, double-sided self-adhesive

Natural viscosity, double-sided self-adhesive

Compliant with ROHS and UL environmental requirements

Compliant with ROHS and UL environmental requirements

Application Way

Voltage Regulation Modules (VRMs) ASICs and DSPs High thermal conductivity module High calorie BGAs Network communication equipment

Application Areas

communication device

communication device

computer

computer

Product Data

PropertyTypical ValueTest Standards
brandHigh-tech-
modelTP1000-
ComponentsSilicone + ceramic-
color    greyVisual
Thickness (mm)0.5~5.0mmASTM D374
Density (g/cc)3.3ASTM D792
Hardness (Shore C)60ASTM D2240
Long-term use temperature (℃)-40~150-
Fire performanceV-0UL94
Electrical properties

Breakdown voltage (kv/mm)>6.0ASTM D149
Dielectric constant (@1Mhz)7.0ASTM D150
Volume resistivity (Ω.cm)1011ASTM D257
Thermal conductivity
Thermal conductivity (W/mK)10.0WASTMD5470


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