The thermal conductivity of high thermal conductivity silicon film can reach 8.0-12w/m-k, making it a high-performance thermal conductivity interface material used to fill the air gap between heating devices and heat sinks or metal bases. Their flexible and elastic characteristics make them suitable for covering completely uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion board, effectively improving heat dissipation performance and enhancing the efficiency and service life of the heating electronic components